Nova & Samsung Unveil Joint Research at SPIE Lithography Conference

TL;DR

**Nova and Samsung just dropped joint research at a key lithography conference, signaling strong tech collaboration!**

AI Summary

NOVA LTD. filed a 6-K on February 27, 2024, announcing a press release titled "Samsung and Nova Publish Joint Research at SPIE Advanced Lithography Conference." This filing indicates a collaboration between Nova and Samsung, where they jointly presented research findings. The publication occurred at the prominent SPIE Advanced Lithography Conference, highlighting advancements in the field.

Why It Matters

This collaboration with Samsung, a global leader in technology and semiconductors, validates Nova's technological capabilities and could open doors for significant future business opportunities and market recognition in advanced lithography.

Risk Assessment

Risk Level: low — The filing reports a positive development (joint research publication with a major industry player) and does not contain any negative financial or operational news.

Key Players & Entities

• NOVA LTD. (company) — registrant
• Samsung (company) — joint research partner
• SPIE Advanced Lithography Conference (event) — venue for research publication

FAQ

Filing Documents

• zk2431049.htm (6-K) — 18KB
• image0.jpg (GRAPHIC) — 7KB
• 0001178913-24-000724.txt ( ) — 30KB

SIGNATURES

SIGNATURES Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized. Date: February 27, 2024 NOVA LTD. (Registrant) By: /s/ Dror David —————————————— Dror David Chief Financial Officer Company Contact: Dror David, Chief Financial Officer Tel: +972-73-229-5760 E-mail - investors@novami.com Nova website link - https://www.novami.com/ Investor Relations Contact: Miri Segal MS-IR LLC Tel: +917-607-8654 E-mail - msegal@ms-ir.com Samsung and Nova Publish Joint Research at SPIE Advanced Lithography Conference Demonstrating In-Line capabilities of Spectral interferometry and Raman Spectroscopy for advanced memory applications REHOVOT, Israel - February 27, 2024 - Nova (Nasdaq: NVMI) today announced that it will publish two co-authored papers with Samsung R&D Center research at SPIE Advanced Lithography 2024. The papers will be presented at the SPIE by Nova and Samsung, at the Metrology, Inspection and Process Control conference. The papers are a result of the continuous collaboration between the companies that is driving numerous innovative joint development programs to enhance advanced chip manufacturing. The papers demonstrate multiple novel technologies Nova avails for advanced process control by developing unique solutions to measure critical parameters of interest on complex structures inside memory arrays. The first paper "Unique Spectral Interferometry Solutions for Complex High Aspect Ratio 3D NAND Structures" demonstrates the capabilities of spectral interferometry (SI) with vertical traveling scatterometry algorithms (VTS) and AI capabilities to solve challenges in complex high-aspect-ratio structures, such as 3D NAND. This is achieved by measuring complex layer thicknesses of the multideck 3D structures directly from the VTS signals, without modeling, while filtering information from the underlayers. In additio

Forward-Looking Statements

Forward-Looking Statements This press release contains forward-looking statements within the meaning of safe harbor provisions of the Private Securities Litigation Reform Act of 1995 relating to future events or our future performance, such as statements regarding, but not limited to, anticipated growth opportunities and projections about our business and its future revenues, expenses and profitability. Forward-looking achievements expressed or implied in those forward-looking statements. Factors that may affect our results, performance, circumstances or achievements include, but are not limited to, the following: increased information technology security threats and sophisticated computer crime; foreign political and economic risks including supply-chain difficulties; regulations that could restrict our operations such as economic sanctions and export restrictions; changes in U.S. trade policies; indirect effects of the Russia – Ukraine conflict; market instability including inflation and recessionary pressures; risks related to doing business with China; catastrophic events; inability to protect our intellectual property; open source technology exposure, including risks related to artificial intelligence; failure to compete effectively or to respond to rapid technological changes; consolidation in our industry; difficulty in predicting the length and strength of any downturn or expansion period of the market we target; factors that adversely affect the pricing and demand for our product lines; dependency on a small number of large customers; dependency on a single manufacturing facility per product line; dependency on a limited number of suppliers; difficulty in integrating current or future acquisitions; lengthy sales cycle an

View Full Filing

View this 6-K filing on SEC EDGAR