NXP Semiconductors Files 8-K

TL;DR

NXPI filed an 8-K, something happened, details TBD.

AI Summary

NXP Semiconductors N.V. filed an 8-K on June 5, 2024, reporting an event under 'Other Events'. The filing does not contain specific details about the event itself, but it confirms the company's reporting status and provides its corporate information, including its principal executive offices in Eindhoven, Netherlands.

Why It Matters

This filing indicates a material event has occurred for NXP Semiconductors, requiring public disclosure. Investors should look for subsequent filings or press releases for details.

Risk Assessment

Risk Level: low — The filing itself is routine and does not contain negative information, but the underlying event is not yet detailed.

Key Players & Entities

• NXP Semiconductors N.V. (company) — Registrant
• June 5, 2024 (date) — Date of report
• Eindhoven, Netherlands (location) — Principal executive offices

FAQ

Key Financial Figures

• $7.8 billion — initial build out is anticipated to be $7.8 billion. VIS will inject $2.4 billion represent
• $2.4 billion — ted to be $7.8 billion. VIS will inject $2.4 billion representing a 60 percent equity positi
• $1.6 billion — n the joint venture and NXP will inject $1.6 billion for the remaining 40 percent equity pos
• $1.9 billion — have agreed to contribute an additional $1.9 billion which will be utilized to support the l

Filing Documents

• nxpi-20240605.htm (8-K) — 32KB
• visandnxptoestablishajoint.htm (EX-99.1) — 12KB
• nxpa.jpg (GRAPHIC) — 16KB
• visa.jpg (GRAPHIC) — 30KB
• 0001413447-24-000066.txt ( ) — 235KB
• nxpi-20240605.xsd (EX-101.SCH) — 2KB
• nxpi-20240605_lab.xml (EX-101.LAB) — 22KB
• nxpi-20240605_pre.xml (EX-101.PRE) — 13KB
• nxpi-20240605_htm.xml (XML) — 3KB

01 Other Events

Item 8.01 Other Events. On June 5, 2024, NXP Semiconductors N.V. (the "Company") and Vanguard International Semiconductor Corporation ("VIS") announced the intention to create a manufacturing joint-venture which will build and operate a new 300mm semiconductor wafer manufacturing facility in Singapore. The joint venture will begin construction of the initial phase of the wafer fab in the second half of 2024, pending receipt of all required regulatory approvals, with initial production available to customers during 2027. The total cost of the initial build out is anticipated to be $7.8 billion. VIS will inject $2.4 billion representing a 60 percent equity position in the joint venture and NXP will inject $1.6 billion for the remaining 40 percent equity position. VIS and NXP have agreed to contribute an additional $1.9 billion which will be utilized to support the long-term capacity infrastructure. The remaining funding including loans will be provided by third parties to the joint venture. The fab will be operated by VIS. A copy of the joint press release issued by the Company and VIS is attached as Exhibit 99.1 to this Current Report on Form 8-K, and is incorporated by reference herein.

Financial Statements and Exhibits

Financial Statements and Exhibits. (d) Exhibits 99.1 Press release dated June 5, 2024 entitled: "VIS and NXP to Establish a Joint Venture to Build and Operate a 300mm Fab". 104 Cover Page Interactive Data File (formatted as Inline XBRL).

SIGNATURES

SIGNATURES Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned hereunto duly authorized. NXP Semiconductors N.V. By: /s/ Timothy Shelhamer Name: Timothy Shelhamer Title: SVP and Chief Corporate Counsel Date: June 5, 2024

View Full Filing

View this 8-K filing on SEC EDGAR