TSMC Files April 2024 6-K Report
Ticker: TSMWF · Form: 6-K · Filed: Apr 4, 2024 · CIK: 1046179
| Field | Detail |
|---|---|
| Company | Taiwan Semiconductor Manufacturing Co Ltd (TSMWF) |
| Form Type | 6-K |
| Filed Date | Apr 4, 2024 |
| Risk Level | low |
| Pages | 2 |
| Reading Time | 2 min |
| Sentiment | neutral |
Sentiment: neutral
Topics: reporting, company-info
TL;DR
TSMC filed its April 6-K, confirming 20-F annual reports.
AI Summary
Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) filed a Form 6-K on April 4, 2024. This report is for the month of April 2024 and indicates that TSMC files its annual reports under Form 20-F. The filing provides basic company information and addresses.
Why It Matters
This filing confirms TSMC's reporting status and provides official contact and address information for the semiconductor giant.
Risk Assessment
Risk Level: low — This is a routine filing that provides standard company information and does not contain new financial or operational disclosures.
Key Players & Entities
- Taiwan Semiconductor Manufacturing Company Ltd. (company) — Registrant
- TSMC (company) — Abbreviation for Registrant
- 001-14700 (dollar_amount) — SEC File Number
- 24821805 (dollar_amount) — Film Number
- No. 8, Li-Hsin Rd. 6, Hsinchu Science Park, Taiwan, R.O.C. (company) — Principal Executive Offices Address
FAQ
What type of report is Taiwan Semiconductor Manufacturing Company Ltd. filing?
Taiwan Semiconductor Manufacturing Company Ltd. is filing a Form 6-K, which is a Report of Foreign Private Issuer.
Under which form does TSMC file its annual reports?
TSMC files its annual reports under cover of Form 20-F.
What is the SEC File Number for this filing?
The SEC File Number for this filing is 001-14700.
What is the principal executive office address for TSMC?
The principal executive office address is No. 8, Li-Hsin Rd. 6, Hsinchu Science Park, Taiwan, R.O.C.
What period does this Form 6-K report cover?
This Form 6-K report is for the month of April 2024.
Filing Stats: 514 words · 2 min read · ~2 pages · Grade level 12.2 · Accepted 2024-04-04 09:20:12
Filing Documents
- a20240404.htm (6-K) — 17KB
- 0001046179-24-000036.txt ( ) — 18KB
SIGNATURES
SIGNATURES Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized. Taiwan Semiconductor Manufacturing Company Ltd. Date April 4, 2024 By s Wendell Huang Wendell Huang Senior Vice President and Chief Financial Officer TSMC Updated Statement on April 3rd Earthquake Taiwan experienced a number of earthquakes on April 3, reaching as high as magnitude level 7.2 (the largest in Taiwan over the past 25 years). The maximum magnitude at the Hsinchu, Longtan, and Zhunan science parks was 5, and reached magnitude 4 at the Taichung and Tainan science parks. Safety systems at TSMC's Taiwan fabs operated normally. Preventative measures to ensure employee safety and wellbeing were initiated at that time according to procedure, and some fabs were evacuated. All personnel are safe and returned to their workplace shortly after the incident. The company is currently evaluating the impact. Initial inspections show that our construction sites are normal. However, the Company suspended work at construction sites for April 3, and work has resumed today (April 4) after further inspections. Based on TSMC's ample experience and capabilities in earthquake response and damage prevention, as well as regular disaster drills to ensure full readiness, overall tool recovery of our fabs reached more than 70% within 10 hours of the earthquake, with new fabs such as the Fab 18 facility reaching more than 80%. As of April 4, overall tool recovery of our fabs reached more than 80%, with new fabs such as the Fab 18 facility are expected to reach full recovery later tonight. A small number of tools were damaged at certain facilities, partially impacting their operations. However, there is no damage to our critical tools including all of our extreme ultraviolet (EUV) lithography tools. Certain production lines in areas which experienced greater seismic impact