TSMC Files April 2024 6-K Report
Ticker: TSMWF · Form: 6-K · Filed: Apr 8, 2024 · CIK: 1046179
| Field | Detail |
|---|---|
| Company | Taiwan Semiconductor Manufacturing Co Ltd (TSMWF) |
| Form Type | 6-K |
| Filed Date | Apr 8, 2024 |
| Risk Level | low |
| Pages | 4 |
| Reading Time | 5 min |
| Key Dollar Amounts | $6.6 Billion, $65 Billion, $6.6 billion, $65 b, $5 billion |
| Sentiment | neutral |
Sentiment: neutral
Topics: reporting, sec-filing
TL;DR
TSMC filed its April 6-K, confirming 20-F annual reports. Standard info.
AI Summary
Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) filed a Form 6-K on April 8, 2024. This report is for the month of April 2024 and indicates that TSMC files its annual reports under Form 20-F. The filing provides basic company information and addresses.
Why It Matters
This filing confirms TSMC's reporting status and provides standard corporate information, which is essential for investors tracking the semiconductor giant.
Risk Assessment
Risk Level: low — This is a routine filing providing standard corporate information and confirming reporting procedures, not indicating new material events.
Key Players & Entities
- Taiwan Semiconductor Manufacturing Company Ltd. (company) — Registrant
- TSMC (company) — Abbreviation for Registrant
- 001-14700 (dollar_amount) — SEC File Number
- 24828135 (dollar_amount) — Film Number
- April 2024 (date) — Reporting Period
FAQ
What is the primary purpose of this Form 6-K filing?
The primary purpose of this Form 6-K filing is to report information for the month of April 2024 and to confirm that Taiwan Semiconductor Manufacturing Company Ltd. files its annual reports under Form 20-F.
What is the SEC file number for Taiwan Semiconductor Manufacturing Company Ltd.?
The SEC file number for Taiwan Semiconductor Manufacturing Company Ltd. is 001-14700.
What is the principal executive office address of the registrant?
The principal executive office address is No. 8, Li-Hsin Rd. 6, Hsinchu Science Park, Taiwan, R.O.C.
Does TSMC file its annual reports under Form 20-F or Form 40-F?
TSMC files its annual reports under Form 20-F, as indicated by the checkmark next to 'Form 20-F'.
What is the standard industrial classification code for TSMC?
The standard industrial classification code for TSMC is 3674, which corresponds to 'SEMICONDUCTORS & RELATED DEVICES'.
Filing Stats: 1,269 words · 5 min read · ~4 pages · Grade level 10.9 · Accepted 2024-04-08 06:36:29
Key Financial Figures
- $6.6 Billion — Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, t
- $65 Billion — s total investment in Arizona to over US$65 Billion PHOENIX, Arizona, Apr. 8, 2024 – TSMC
- $6.6 billion — y memorandum of terms (PMT) for up to US$6.6 billion in direct funding under the CHIPS and S
- $65 b — he Phoenix, Arizona site to more than US$65 billion, making the site the largest fore
- $5 billion — o proposes to provide TSMC with up to US$5 billion in loans. TSMC plans to apply for U.S.
Filing Documents
- a20240408.htm (6-K) — 29KB
- 0001046179-24-000040.txt ( ) — 30KB
SIGNATURES
SIGNATURES Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized. Taiwan Semiconductor Manufacturing Company Ltd. Date April 8, 2024 By s Wendell Huang Wendell Huang Senior Vice President and Chief Financial Officer TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix Third fab will produce the most advanced leading-edge semiconductors in the U.S., bringing TSMC's total investment in Arizona to over US$65 Billion PHOENIX, Arizona, Apr. 8, 2024 – TSMC (TWSE 2330, NYSE TSM) today announced that the U.S. Department of Commerce and TSMC Arizona have signed a non-binding preliminary memorandum of terms (PMT) for up to US$6.6 billion in direct funding under the CHIPS and Science Act. TSMC also announced plans to build a third fab at TSMC Arizona to meet strong customer demand leveraging the most advanced semiconductor process technology in the United States. As the company makes progress in completing its first fab and continues construction of its second fab at its Arizona subsidiary, the third fab brings TSMC's total capital expenditure for the Phoenix, Arizona site to more than US$65 billion, making the site the largest foreign direct investment in Arizona history, and the largest foreign direct investments in a greenfield project in U.S. history. "The CHIPS and Science Act provides TSMC the opportunity to make this unprecedented investment and to offer our foundry service of the most advanced manufacturing technologies in the United States," said TSMC Chairman Dr. Mark Liu. "Our U.S. operations allow us to better support our U.S. customers, which include several of the world's leading technology companies. Our U.S. operations will also expand our capability to trailblaze future advancements in semiconductor te