TSMC Files Routine 6-K Report

TL;DR

TSMC filed its monthly 6-K, standard procedure, no major news.

AI Summary

Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) filed a Form 6-K on July 23, 2024, reporting for the month ending June 30, 2024. The filing is a routine report for a foreign private issuer and does not contain specific financial figures or significant operational updates beyond its periodic reporting nature.

Why It Matters

This filing indicates TSMC is adhering to its reporting obligations as a foreign private issuer, providing transparency to investors about its ongoing compliance.

Risk Assessment

Risk Level: low — The filing is a routine report and does not contain any new material information that would alter the company's risk profile.

Key Numbers

• 20240630 — Reporting Period End Date (Indicates the period covered by the report.)
• 20240723 — Filing Date (The date the report was officially submitted to the SEC.)

Key Players & Entities

• Taiwan Semiconductor Manufacturing Company Ltd. (company) — Filer
• TSMC (company) — Abbreviation for filer

FAQ

Key Financial Figures

• $22.6 billion — idiaries (1) Fixed-income investment NT$22.6 billion of acquisition and NT$0.3 billion of di
• $0.3 billion — nt NT$22.6 billion of acquisition and NT$0.3 billion of disposition. (2) Machinery equipmen
• $3.1 billion — s for an aggregate purchase amount of NT$3.1 billion to offset the dilutive effect of the is
• $2,048 million — ment for advanced technology capacity US$2,048 million. (2) Machinery equipment for advanced
• $4,294 million — e andor specialty technology capacity US$4,294 million. (3) Real estate and capitalized lease
• $11,014 million — estate and capitalized leased assets US$11,014 million. 5. The unsecured bonds issued by TSMC

Filing Documents

• tsm-monthend6kx20240723.htm (6-K) — 30KB
• 0001046179-24-000085.txt ( ) — 31KB

SIGNATURES

SIGNATURES Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized. Taiwan Semiconductor Manufacturing Company Ltd. Date July 23, 2024 By s Wendell Huang Wendell Huang Senior Vice President and Chief Financial Officer Taiwan Semiconductor Manufacturing Company Limited (TSMC NYSE TSM) This is to report 1) the changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC 2) the changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC 3) the acquisition and disposition of assets by TSMC and its subsidiaries 4) the capital appropriations approved by TSMC board of directors and 5) the unsecured bonds issued by TSMC and its subsidiaries for the month of June 2024. 1. The changes in the shareholdings of TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC Title Name Number of shares held as of Changes 5312024 6302024 Senior Vice President Cliff Hou 498,212 499,293 1,081 Senior Vice President and Chief Financial Officer Wendell Huang 1,660,178 1,660,187 9 Vice President Simon Jang 358,582 358,832 250 Vice President Jonathan Lee 402,988 404,286 1,298 Note Shareholdings include shares held by the related parties. 2. The changes in the pledge of TSMC common shares by TSMC board of directors, executive officers and shareholders who own more than 10% of total outstanding common shares of TSMC Inapplicable. 3. The acquisition and disposition of assets by TSMC and its subsidiaries (1) Fixed-income investment NT$22.6 billion of acquisition and NT$0.3 billion of disposition. (2) Machinery equipment NT$0.3 billion of disposition. (3) Share Repurchase

View Full Filing

View this 6-K filing on SEC EDGAR