TSMC Files Routine 6-K Disclosure
Ticker: TSMWF · Form: 6-K · Filed: Aug 20, 2024 · CIK: 1046179
| Field | Detail |
|---|---|
| Company | Taiwan Semiconductor Manufacturing Co Ltd (TSMWF) |
| Form Type | 6-K |
| Filed Date | Aug 20, 2024 |
| Risk Level | low |
| Pages | 4 |
| Reading Time | 4 min |
| Sentiment | neutral |
Sentiment: neutral
Topics: sec-filing, routine-disclosure, foreign-private-issuer
TL;DR
TSMC filed a 6-K, standard procedure, no new info.
AI Summary
Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) filed a Form 6-K on August 20, 2024. This report is for the month of August 2024 and indicates that TSMC files its annual reports under Form 20-F. The filing does not contain specific financial figures or operational updates but serves as a routine disclosure for foreign private issuers.
Why It Matters
This filing is a standard procedural document for TSMC as a foreign private issuer, confirming their reporting schedule and format with the SEC.
Risk Assessment
Risk Level: low — This is a routine administrative filing by TSMC, not containing new material financial or operational information.
Key Players & Entities
- Taiwan Semiconductor Manufacturing Company Ltd. (company) — Filer
- TSMC (company) — Abbreviation for Filer
- 001-14700 (other) — SEC File Number
- 20-F (other) — Annual Report Form
- 6-K (other) — Filing Form
FAQ
What type of filing is this Form 6-K?
This is a Report of Foreign Private Issuer pursuant to Rule 13a-16 or 15d-16 under the Securities Exchange Act of 1934.
What is the SEC file number for Taiwan Semiconductor Manufacturing Company Ltd.?
The SEC file number is 001-14700.
Does TSMC file annual reports under Form 20-F or 40-F?
TSMC indicates it files annual reports under cover of Form 20-F.
What period does this Form 6-K report cover?
This Form 6-K is for the month of August 2024.
What is the principal executive office address for TSMC?
The principal executive offices are located at No. 8, Li-Hsin Rd. 6, Hsinchu Science Park, Taiwan, R.O.C.
Filing Stats: 1,061 words · 4 min read · ~4 pages · Grade level 13.6 · Accepted 2024-08-20 09:18:59
Filing Documents
- esmcbreaksgroundondresdenf.htm (6-K) — 28KB
- image01.jpg (GRAPHIC) — 5KB
- 0001046179-24-000097.txt ( ) — 36KB
SIGNATURES
SIGNATURES Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized. Taiwan Semiconductor Manufacturing Company Ltd. Date August 20, 2024 By s Wendell Huang Wendell Huang Senior Vice President and Chief Financial Officer ESMC Breaks Ground on Dresden Fab DRESDEN, Germany August 20, 2024 – ESMC – a joint venture between TSMC (TWSE 2330, NYSE TSM), Robert Bosch GmbH, Infineon Technologies AG and NXP Semiconductors N.V. – today held a groundbreaking ceremony to officially mark the initial phase of land preparation for its first semiconductor fab in Dresden, Germany. The event brought together government officials, customers, suppliers, business partners and academia to celebrate a milestone in establishing what will be the EU's first-ever FinFET-capable pure-play foundry. Distinguished guests included president of the European Commission Ursula von der Leyen, German Chancellor Olaf Scholz, and Saxony Minister President Michael Kretschmer and Lord Mayor of Dresden, Dirk Hilbert. In a demonstration of dedicated support, during the event, President von der Leyen announced that the European Commission has approved, under EU State aid rules, a 5 billion German measure to support European Semiconductor Manufacturing Company (ESMC) in the construction and operation of the semiconductor fab. "Together with our partners, Bosch, Infineon and NXP, we are building our Dresden facility to meet the semiconductor needs of the rapidly growing European automotive and industrial sectors," said TSMC Chairman CEO C.C. Wei. "With this state-of-the-art manufacturing facility, we will bring TSMC's advanced manufacturing capabilities within reach of our European customers and partners, which will stimulate economic development within the region and drive technological advancements across Europe." When fully operational, ESMC is expected to have a