TSMC Files 6-K for October 2024
Ticker: TSMWF · Form: 6-K · Filed: Oct 3, 2024 · CIK: 1046179
| Field | Detail |
|---|---|
| Company | Taiwan Semiconductor Manufacturing Co Ltd (TSMWF) |
| Form Type | 6-K |
| Filed Date | Oct 3, 2024 |
| Risk Level | low |
| Pages | 3 |
| Reading Time | 4 min |
| Sentiment | neutral |
Sentiment: neutral
Topics: regulatory-filing, foreign-private-issuer
TL;DR
TSMC filed its 6-K for Oct 2024, confirming 20-F reporting and HQ address in Taiwan.
AI Summary
Taiwan Semiconductor Manufacturing Company Ltd. (TSMC) filed a Form 6-K on October 3, 2024, for the month of October 2024. The filing indicates that TSMC is a foreign private issuer and will file its annual reports under Form 20-F. The company's principal executive offices are located at No. 8, Li-Hsin Rd. 6, Hsinchu Science Park, Taiwan, R.O.C.
Why It Matters
This filing confirms TSMC's reporting status and provides its official address, which is relevant for investors tracking the company's regulatory compliance and operational base.
Risk Assessment
Risk Level: low — This is a routine periodic filing (6-K) that does not contain new material financial information or strategic changes.
Key Players & Entities
- Taiwan Semiconductor Manufacturing Company Ltd. (company) — Filer
- TSMC (company) — Abbreviation for filer
- No. 8, Li-Hsin Rd. 6, Hsinchu Science Park, Taiwan, R.O.C. (location) — Principal Executive Offices
FAQ
What type of SEC filing is this?
This is a Form 6-K, which is a Report of Foreign Private Issuer.
What period does this 6-K report cover?
This 6-K is filed for the month of October 2024.
Under which form does TSMC file its annual reports?
TSMC files its annual reports under cover of Form 20-F.
Where are TSMC's principal executive offices located?
TSMC's principal executive offices are located at No. 8, Li-Hsin Rd. 6, Hsinchu Science Park, Taiwan, R.O.C.
What is the SEC file number for Taiwan Semiconductor Manufacturing Company Ltd.?
The SEC file number for Taiwan Semiconductor Manufacturing Company Ltd. is 001-14700.
Filing Stats: 889 words · 4 min read · ~3 pages · Grade level 13.4 · Accepted 2024-10-03 17:19:35
Filing Documents
- amkorandtsmctoexpandpartne.htm (6-K) — 28KB
- 0001046179-24-000112.txt ( ) — 29KB
SIGNATURES
SIGNATURES Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized. Taiwan Semiconductor Manufacturing Company Ltd. Date October 4, 2024 By s Wendell Huang Wendell Huang Senior Vice President and Chief Financial Officer Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona TEMPE, Ariz. and HSINCHU, Taiwan, R.O.C. Oct. 4, 2024 – Amkor Technology, Inc. (Nasdaq AMKR) and TSMC (TWSE 2330, NYSE TSM) announced today that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region's semiconductor ecosystem. Amkor and TSMC have been closely collaborating to deliver high volume, leading-edge technologies for advanced packaging and testing of semiconductors to support critical markets such as high-performance computing and communications. Under the agreement, TSMC will contract turnkey advanced packaging and test services from Amkor in their planned facility in Peoria, Arizona. TSMC will leverage these services to support its customers, particularly those using TSMC's advanced wafer fabrication facilities in Phoenix. The close collaboration and proximity of TSMC's front-end fab and Amkor's back-end facility will accelerate overall product cycle times. The companies will jointly define the specific packaging technologies, such as TSMC's Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS ) that will be employed to address common customers' needs. The agreement underscores the shared commitment to supporting customer requirements for geographic flexibility in front-end and back-end manufacturing, as well as fostering the development of a vibrant and comprehensive semiconductor manufacturing ecosystem in the United States. The companies' shared vision is to enable seamless technology