ChipMOS Technologies Files March 2024 6-K Report

Ticker: IMOS · Form: 6-K · Filed: Mar 14, 2024 · CIK: 1123134

Sentiment: neutral

Topics: 6-K, foreign-issuer, reporting

TL;DR

ChipMOS filed its March 6-K, standard procedure for foreign issuers.

AI Summary

ChipMOS TECHNOLOGIES INC. filed a Form 6-K on March 14, 2024, to report its activities for the month of March 2024. The filing indicates that the company is a foreign private issuer and is submitting its report under Rule 13a-16 or 15d-16 of the Securities Exchange Act of 1934. ChipMOS TECHNOLOGIES INC. is incorporated in Taiwan and its principal executive offices are located in Hsinchu Science Park.

Why It Matters

This filing provides routine updates for investors and the market regarding ChipMOS Technologies' compliance and reporting status as a foreign private issuer.

Risk Assessment

Risk Level: low — This is a routine filing for a foreign private issuer and does not contain specific financial results or material business changes.

Key Players & Entities

FAQ

What is the purpose of a Form 6-K filing?

A Form 6-K is a report of foreign private issuers pursuant to Rule 13a-16 or 15d-16 under the Securities Exchange Act of 1934, used to furnish information which the registrant may be required to disclose or make public in connection with its home country's securities laws or stock exchange rules.

When was this specific Form 6-K filed?

This Form 6-K was filed on March 14, 2024.

What is the company's primary business address?

The company's principal executive offices are located at No. 1, R&D Rd. 1, Hsinchu Science Park, Hsinchu, Taiwan.

Does ChipMOS TECHNOLOGIES INC. file annual reports on Form 20-F or 40-F?

Yes, ChipMOS TECHNOLOGIES INC. indicated it files annual reports under cover of Form 20-F.

What is the SIC code for ChipMOS TECHNOLOGIES INC.?

The Standard Industrial Classification (SIC) code for ChipMOS TECHNOLOGIES INC. is 3674, which corresponds to SEMICONDUCTORS & RELATED DEVICES.

Filing Stats: 545 words · 2 min read · ~2 pages · Grade level 11.9 · Accepted 2024-03-14 06:04:09

Filing Documents

SIGNATURES

SIGNATURES Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized. ChipMOS TECHNOLOGIES INC. (Registrant) Date: March 14, 2024 By /S/ S. J. Cheng Name: S. J. Cheng Title: Chairman & President Contacts: In Taiwan Jesse Huang ChipMOS TECHNOLOGIES INC. +886-6-5052388 ext. 7715 IR@chipmos.com In the U.S. David Pasquale Global IR Partners +1-914-337-8801 dpasquale@globalirpartners.com ChipMOS to Present at BofA Securities 2024 APAC TMT CONFERENCE Hsinchu, Taiwan - March 14, 2024 - ChipMOS TECHNOLOGIES INC. (“ChipMOS” or the “Company”) (Taiwan Stock Exchange: 8150 and Nasdaq: IMOS), an industry leading provider of outsourced semiconductor assembly and test services (“OSAT”), today announced that it will present to institutional investors at the BofA Securities 2024 APAC TMT Conference, at the Grand Hyatt Taipei on Thursday, March 21 2024. Management from the Company, including Jesse Huang, Senior Vice President of Strategy and Investor Relations, will discuss the Company’s recent financial results, business trends and growth opportunities. The Company’s investor presentation is available on the investor relations’ section of its website at www.chipmos.com. About ChipMOS TECHNOLOGIES INC.: ChipMOS TECHNOLOGIES INC. (“ChipMOS” or the “Company”) (Taiwan Stock Exchange: 8150 and Nasdaq: IMOS) (www.chipmos.com) is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS is known for its track record of excellence and history of innovation. The Company provides end-to-end assembly and test services to leading fabless semiconductor companies, integrated device

Forward-Looking Statements

Forward-Looking Statements: This press release may contain certain forward-looking statements. These forward-looking statements may be identified by words such as ‘believes,’ ‘expects,’ ‘anticipates,’ ‘projects,’ ‘intends,’ ‘should,’ ‘seeks,’ ‘estimates,’ ‘future’ or similar expressions or by discussion of, among other things, strategies, goals, plans or intentions. These statements may include financial projections and estimates and their underlying assumptions, statements regarding plans, objectives and expectations with respect to future operations, products and services, and statements regarding future performance. Actual results may differ materially in the future from those reflected in forward-looking statements contained in this document, due to various factors. Further information regarding these risks, uncertainties and other factors are included in the Company’s most recent Annual Report on Form 20-F filed with the U.S. Securities and Exchange Commission (the “SEC”) and in the Company’s other filings with the SEC.

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