NXP Semiconductors Files 8-K

TL;DR

NXPI filed an 8-K, something happened, details TBD.

AI Summary

NXP Semiconductors N.V. filed an 8-K on June 5, 2024, reporting an event under 'Other Events'. The filing does not contain specific details about the event itself, but it confirms the company's reporting status and provides its corporate information, including its principal executive offices in Eindhoven, Netherlands.

Why It Matters

This filing indicates a material event has occurred for NXP Semiconductors, requiring public disclosure. Investors should look for subsequent filings or press releases for details.

Risk Assessment

Risk Level: low — The filing itself is routine and does not contain negative information, but the underlying event is not yet detailed.

Key Players & Entities

• NXP Semiconductors N.V. (company) — Registrant
• June 5, 2024 (date) — Date of report
• Eindhoven, Netherlands (location) — Principal executive offices

FAQ

From the Filing

0001413447-24-000066.txt : 20240605 0001413447-24-000066.hdr.sgml : 20240605 20240605061316 ACCESSION NUMBER: 0001413447-24-000066 CONFORMED SUBMISSION TYPE: 8-K PUBLIC DOCUMENT COUNT: 16 CONFORMED PERIOD OF REPORT: 20240605 ITEM INFORMATION: Other Events FILED AS OF DATE: 20240605 DATE AS OF CHANGE: 20240605 FILER: COMPANY DATA: COMPANY CONFORMED NAME: NXP Semiconductors N.V. CENTRAL INDEX KEY: 0001413447 STANDARD INDUSTRIAL CLASSIFICATION: SEMICONDUCTORS & RELATED DEVICES [3674] ORGANIZATION NAME: 04 Manufacturing IRS NUMBER: 000000000 FISCAL YEAR END: 1231 FILING VALUES: FORM TYPE: 8-K SEC ACT: 1934 Act SEC FILE NUMBER: 001-34841 FILM NUMBER: 241020655 BUSINESS ADDRESS: BUSINESS PHONE: 31 6 54 265349 MAIL ADDRESS: STREET 1: HIGH TECH CAMPUS 60 CITY: EINDHOVEN STATE: P7 ZIP: 5656AG FORMER COMPANY: FORMER CONFORMED NAME: KASLION Acquisition B.V. DATE OF NAME CHANGE: 20070925 8-K 1 nxpi-20240605.htm 8-K nxpi-20240605 0001413447 false 0001413447 2024-06-05 2024-06-05 UNITED STATES SECURITIES AND EXCHANGE COMMISSION Washington, D.C. 20549 FORM 8-K   CURRENT REPORT PURSUANT TO SECTION 13 OR 15(d) OF THE SECURITIES EXCHANGE ACT OF 1934 Date of report (Date of earliest event reported): June 5, 2024     NXP Semiconductors N.V. (Exact name of Registrant as specified in charter) Netherlands 001-34841 98-1144352 (State or other jurisdiction of incorporation) (Commission file number) (IRS employer identification number) 60 High Tech Campus Eindhoven Netherlands 5656 AG (Address of principal executive offices) (Zip code) +31 40 2729999 (Registrant’s telephone number, including area code)   NA (Former name or former address, if changed since last report)   Check the appropriate box below if the Form 8-K filing is intended to simultaneously satisfy the filing obligation of the registrant under any of the following provisions: ☐ Written communications pursuant to Rule 425 under the Securities Act (17 CFR 230.425) ☐ Soliciting material pursuant to Rule 14a-12 under the Exchange Act (17 CFR 240.14a-12) ☐ Pre-commencement communications pursuant to Rule 14d-2(b) under the Exchange Act (17 CFR 240.14d-2(b)) ☐ Pre-commencement communications pursuant to Rule 13e-4(c) under the Exchange Act (17 CFR 240.13e-4c)) Securities registered pursuant to Section 12(b) of the Act: Title of each class Trading symbol(s) Number of each exchange on which registered Common shares, EUR 0.20 par value NXPI The Nasdaq Global Select Market Indicate by check mark whether the registrant is an emerging growth company as defined in Rule 405 of the Securities Act of 1933 (§230.405) or Rule 12b-2 of the Securities Exchange Act of 1934 (§240.12b-2).                                         Emerging growth company   ☐          If an emerging growth company, indicate by check mark if the registrant has elected not to use the extended transition period for complying with any new or revised financial accounting standards provided pursuant to Section 13(a) of the Exchange Act      ¨       Item 8.01 Other Events. On June 5, 2024, NXP Semiconductors N.V. (the “Company”) and Vanguard International Semiconductor Corporation (“VIS”) announced the intention to create a manufacturing joint-venture which will build and operate a new 300mm semiconductor wafer manufacturing facility in Singapore. The joint venture will begin construction of the initial phase of the wafer fab in the second half of 2024, pending receipt of all required regulatory approvals, with initial production available to customers during 2027. The total cost of the initial build out is anticipated to be $7.8 bi