Tower Semiconductor Announces Q2 2024 Results
Ticker: TSEM · Form: 6-K · Filed: Jul 3, 2024 · CIK: 928876
Sentiment: neutral
Topics: earnings, financial-results, foreign-private-issuer
TL;DR
Tower Semi dropped Q2 results 7/3, check the 6-K for details.
AI Summary
Tower Semiconductor Ltd. announced its second quarter 2024 financial results on July 3, 2024. The company is a foreign private issuer and is filing a Form 6-K report with the SEC. Specific financial figures for the second quarter were not detailed in this filing excerpt.
Why It Matters
This filing provides an update on Tower Semiconductor's financial performance, which is crucial for investors to assess the company's current health and future prospects in the semiconductor industry.
Risk Assessment
Risk Level: low — This filing is a routine financial results announcement and does not contain significant new risks or material adverse information.
Key Players & Entities
- Tower Semiconductor Ltd. (company) — Registrant
- 0001178913-24-002131 (filing_id) — Accession Number
- July 3, 2024 (date) — Announcement Date
FAQ
What is the purpose of this Form 6-K filing?
The Form 6-K is a report of foreign private issuer pursuant to Rule 13a-16 or 15d-16 of the Securities Exchange Act of 1934, used by Tower Semiconductor Ltd. to announce its second quarter 2024 financial results.
When did Tower Semiconductor Ltd. announce its second quarter 2024 financial results?
Tower Semiconductor Ltd. announced its second quarter 2024 financial results on July 3, 2024.
Is Tower Semiconductor Ltd. required to file Form 20-F or Form 40-F?
Tower Semiconductor Ltd. indicates it files annual reports under cover of Form 20-F.
Does Tower Semiconductor Ltd. furnish information to the SEC pursuant to Rule 12g3-2(b)?
No, Tower Semiconductor Ltd. does not furnish information to the SEC pursuant to Rule 12g3-2(b) under the Securities Exchange Act of 1934.
What is the principal executive office address for Tower Semiconductor Ltd.?
The principal executive offices are located at Ramat Gavriel Industrial Park, P.O. Box 619, Migdal Haemek, Israel, 2310502.
Filing Stats: 536 words · 2 min read · ~2 pages · Grade level 11.2 · Accepted 2024-07-03 06:02:07
Filing Documents
- zk2431635.htm (6-K) — 14KB
- image0.jpg (GRAPHIC) — 426KB
- 0001178913-24-002131.txt ( ) — 601KB
SIGNATURES
SIGNATURES Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized. TOWER SEMICONDUCTOR LTD. Date: July 3, 2024 By: /s/ Nati Somekh Name: Nati Somekh Title: Corporate Secretary Tower Semiconductor Announces Second Quarter 2024 Financial Results and Conference Call MIGDAL HAEMEK, Israel – July 3, 2024 – Tower Semiconductor (NASDAQ/ TASE: TSEM), the leading foundry of high value analog semiconductor solutions, will issue its second quarter 2024 earnings release on Wednesday, July 24, 2024. The Company will hold a conference call to discuss its second quarter 2024 financial results and third quarter 2024 guidance on Wednesday, July 24, 2024, at 10:00 a.m. Eastern Time (09:00 a.m. Central, 08:00 a.m. Mountain, 07:00 a.m. Pacific and 05:00 p.m. Israel time). This call will be webcasted and can be accessed through the Investor Relations section on Tower Semiconductor's website at https://ir.towersemi.com/ or can also be accessed by calling the following numbers: U.S. Toll Free: 1-888-281-1167; Israel: 03-918-0610; International: +972-3-918-0610. The teleconference will be available for replay for 90 days. About Tower Semiconductor Tower Semiconductor Ltd. (NASDAQ/TASE: TSEM), the leading foundry of high-value analog semiconductor solutions, provides technology, development, and process platforms for its customers in growing markets such as consumer, industrial, automotive, mobile, infrastructure, medical and aerospace and defense. Tower Semiconductor focuses on creating a positive and sustainable impact on the world through long-term partnerships and its advanced and innovative analog technology offering, comprised of a broad range of customizable process platforms such as SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors, displays, integrated power management (BCD and 700V), photonics, and MEMS. Towe